Dielectric cooling uses 7% of the power of traditional air cooling and will appear in products in 2018
Dielectric cooling uses 7% of the power of traditional air cooling and will appear in products in 2018
“IBM, Georgia Tech and DARPA developed a new cooling technology to overcome the thermal barrier of stacking chips, an on-chip solution that could help to even cool off entire datacenters.
The technologies are expected to appear in commercial products and military gear as soon as 2018…”
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